Solder Paste Challenges for Printed Circuit Boards.

Solder Paste Challenges for Printed Circuit Boards.

October 23, 2014 in Industry News

How can I improve the accuracy of tiny solder paste deposit measurements?

This is a question we are asked often.  As the electronics industry demands lower costs, more component density and smaller and smaller components, it is becoming increasingly more difficult to screen print and measure very tiny solder paste deposits with high yields.

And the challenge doesn’t end there.  Once you determine how to measure the smallest deposits, the question then becomes how do I ensure I do it again and again with the same level of accuracy – on all printed circuit boards?  What do I do when I go even smaller? And what are the latest methods to achieve and maintain the right measurements of PCBs? Read more:

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